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| ÇöÀçÀ§Ä¡ : HOME> PRODUCT> ±âŸ »ê¾÷¿ëµð¹ÙÀ̽º> Cooling Devices |
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Operating Temperature vs System Reliability
At elevated temperatures a silicon device can fail catastrophically, but even if it doesn't, its electrical characteristics frequently undergo intermittent or permanent changes. Manufacturers of processors and other computer components specify a maximum operating temperature for their products. Most devices are not certified to function properly beyond 50¡ÆC-80¡ÆC. However, in a loaded PC with standard cooling, operating temperatures can easily exceed the limits. The result can be memory errors, hard disk read-write errors, faulty video, and other problems not commonly recognized as heat related. The life of an electronic device is directly related to its operating temperature. Each 10¡ÆC temperature rise reduces component life by 50%*. Conversely, each 10¡ÆC temperature reduction increases component life by 100%. Therefore, it is recommended that computer components be kept as cool as possible (within an acceptable noise level) for maximum reliability, longevity, and return on investment. *Based on the Arrhenius equation, which says that time to failure is a function of e-Ea/kT where Ea=activation energy of the failure mechanism being accelerated, k=Boltzmann's constant, and T=absolute temperature |
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Thermal Compound(Non-silicon, synthetic based material designed to eliminate problems such as contamination and migration commonly linked with silicon. Insures quick, efficient heat transfer and dissipation. Application/Advantage: No creep, bleed, separation, or migration. |
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Test |
Test Method |
Result |
Appearance |
Visual |
White Paste |
Consistency-Penetration |
ASTM D-217 |
390-410 |
Specific Gravity@ 25¡ÆC |
ASTM D-70 |
2.7 |
Bleed, 24 hrs.%Wt( 150¡Æ,200¡Æ) |
FTM-321 (modified) |
(Nil, 0.10) |
Evaporation, 24 hrs.%Wt( 150¡Æ, 200¡Æ) |
FTM-321(modified) |
(0.10, 0.60) |
Thermal Conductivity@ 36¡ÆC( Cal/Sec, cm¡ÆC) |
MIL-C-47113 |
16.7 x 10 -4 |
Dielectric Strength, Volts/mil |
ASTM D-149 |
305 |
Dielectric Constant, 1K Hz @ 25¡ÆC |
ASTM D-150 |
4.5 |
Dissipation Factor, 1K Hz @ 25¡ÆC |
ASTM D-150 |
0.0029 |
Operating Range |
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-40 ¡ÆC to 200 ¡ÆC |
Flow Rate, grams/min |
AOS Method |
20 |
Material Compatibility |
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Metal, Plastic |
Shelf Life |
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5 Years. (min.) |
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| ELK-VCPC47 |
Low Profile, Solid-copper coolers for P4, SKT478 |
| ELK-VCPC60 |
Low Profile, Solid-copper coolers for Xeon, SKT603(Up to 2.6GHz) |
| ELK-VBP |
Card Cooler for expansion cards |
| ELK-VDC2F |
Drive Cooler for 1 Hard Disk Drive |
| ELK-VDCB3 |
Drive Cooler for 3 Hard Disk Drives |
| ELK-TC |
Thermal Compound |
All specifications within this document are subject to change without notice. |
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