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| 현재위치 : HOME > PRODUCT > 임베디드컴퓨팅 > Expansion Kit |
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| Media module to support USB/DVI/Audio output |
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| System Architecture |
Media Module for ELK-EPC563 to support USB/DVI/Audio output Support TMDS Panel Interface |
| Chipset |
Si164 or compatible TMDS Panel Interface |
| Module Output |
USB x1 DVI: TMDS (Panel) Interface connector x1 (29 pin) MIC-in, Line-in and Speaker-out output |
| Dimensions |
120 (W) x 54 (L) mm |
| Environments |
Operating temperatures: 0°C to 60°C Storage temperatures: -20°C to 80°C Relative humidity: 10% to 90% (Non-condensing) |
| Certification |
CE approval FCC Class A |
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| ELK-EKMedia1 |
Media module for ELK-EPC563 to support USB/DVI/Audio output |
All specifications within this document are subject to change without notice. |
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